لماذا تشوه لوحة PCB؟
تم النشر في 2019-11-21The warpage of the بلوحة PCB في ضعف الاتصال بين المكونات الإلكترونية ووسادات لوحة الدائرة أثناء ترقيع SMT اللاحق ، وقد لا يتم توصيل المكونات تمامًا بالبطانات ، مما قد يتسبب في حدوث منتجات معيبة أو يؤثر على الخصائص الكهربائية لـ لوحة الدائرة. ما الذي يسبب تشوه لوحة ثنائي الفينيل متعدد الكلور؟
1. The circuit diagram of the PCB board is not properly designed. The circuit of the pcb circuit board is obviously asymmetrical, and the copper area of one side of the substrate is large, which causes a large stress, which causes the pcb board to warp. The baking of the board in front of the printed circuit board can relax the stress of the substrate and reduce the warpage of the substrate during the printing process.
2. The PCB circuit board may have slight warpage before printing. In the process of circuit board printing and processing, it is affected by external factors such as heat and chemicals, which increases the warpage of the pcb board.
3. The بلوحة PCB في is not properly stored. The humidity of the pcb board storage space is too high, and the moisture absorption of the board will be deepened after the circuit board absorbs moisture; in particular, the single-panel has a larger moisture absorption area. Therefore, the pcb board without moisture-proof packaging should be stored in a dry space as much as possible, and try to avoid the bare copper plate.
4. The بلوحة PCB في layout method is incorrect. Heavy object extrusion, improper placement, and incorrect packaging will deepen the warpage of the pcb board.
Pbc Allegro manufacturers should take appropriate measures to reduce warpage. Jiedubang pcb adheres to the “quality-centered” business philosophy, checks the substrate before production, screens out the bad substrate, and then bakes the board to relax the stress of the substrate and further reduce the warpage. The substrate with relatively large warpage is flattened by the machine in time, and then the next step is produced, which can effectively reduce the defect rate of the warpage plate. 6pcba is committed to becoming the world’s leading manufacturer of circuit board and sample cards, and continues to provide quality services for the innovation of China’s information electronics industry.
| Project | project name | Process Capability |
|---|---|---|
| Overall process capability | Number of layers | 1-30 Floor |
| High frequency mixing HDI | Ceramic materials, PTFE materials can only be used for mechanical drilling blind buried holes or controlled deep drilling, back drilling, etc. (cannot be laser drilled, can not directly press copper foil) | |
| high speed HDI | Made by conventional HDI | |
| Laser order | 1-5Order（≥6Level needs review） | |
| Plate thickness range | 0.1-5.0mm (less than 0.2mm, more than 6.5mm need to be reviewed,) | |
| Minimum finished size | Veneer 5*5mm (less than 3mm to be reviewed) | |
| Maximum finished size | 2-20 layers 21*33inch; Remarks: The short side of the board exceeds 21inch for review. | |
| Maximum copper thickness | Outer layer 8OZ (more than 8OZ for review), inner layer 6OZ (more than 6OZ for review) | |
| Minimum copper thickness | 1/2oz | |
| Inter-layer alignment | ≤3mil | |
| Through hole filling range | Plate thickness ≤0.6mm, hole diameter ≤0.2mm | |
| Resin plug thickness range | 0.254-6.0mm, PTFE plate resin plug hole needs to be reviewed | |
| Plate thickness tolerance | Plate thickness ≤1.0mm; ±0.1mm | |
| Plate thickness >1.0mm; ±10% | ||
| Impedance tolerance | ±5Ω (<50Ω), ±10% (≥50Ω); ±8% (≥50Ω, review required) | |
| Warpage | Regular: 0.75%, limit 0.5% (requires review) Max. 2.0% | |
| Number of presses | The same core plate is pressed ≤ 5 times (more than 3 times to be evaluated) | |
| material type | Ordinary Tg FR4 | Shengyi S1141, Jianye KB6160A, Guoji GF212 |
| Medium Tg FR4 | Shengyi S1150G (medium Tg sheet), Jianye KB6165F, Jianye KB6165G (halogen-free) | |
| High Tg FR4 | Shengyi S1165 (halogen-free), Jianye KB6167G (halogen-free), Jianye KB6167F | |
| Aluminum plate | Guoji GL12, clear CS-AL-88/89 AD2, Ju Qin JQ-143 1-8 layer mixed FR-4 | |
| HDI board material type | LDPP (IT-180A 1037 and 1086), normal 106 and 1080 | |
| High CTI | Shengyi S1600 | |
| High Tg FR4 | Isola: FR408, FR408HR, IS410, FR406, GETEK, PCL-370HR; Lianmao: IT-180A, IT-150DA; Nelco: N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI; Panasonic: R-5775K (Megtron6), R-5725 (Megtron4); Jianye: KB6167F; Taiwan: EM-827; Hongren: GA-170; South Asia: NP-180; Tai Yao: TU-752, TU-662; Hitachi: MCL-BE-67G (H), MCL-E-679 (W), MCL-E-679F (J); Tenghui: VT-47; |
|
| Ceramic powder filled with high frequency material | Rogers：Rogers4350、Rogers4003;Arlon:25FR、25N; | |
| PTFE high frequency material | Rogers, Taconic, Arlon, Nelco, TP | |
| PTFE prepreg | Taconic: TP series, TPN series, HT1.5 (1.5mil), Fastrise series | |
| Material mixing | Rogers, Taconic, Arlon, Nelco and FR-4 | |
| Metal substrate | Number of layers | Aluminum substrate, copper substrate: 1-8 layers; cold plate, sintered plate, buried metal plate: 2-24 layers; ceramic plate: 1-2 layers; |
| Finished product size (aluminum substrate, copper substrate, cold plate, sintered plate, buried metal plate) | MAX:610*610mm、MIN:5*5mm | |
| Largest production size (ceramic plate) | 100*100mm | |
| Finished board thickness | 0.5-5.0mm | |
| Copper thickness | 0.5-10 OZ | |
| Metal base thickness | 0.5-4.5mm | |
| Metal base material | AL：1100/1050/2124/5052/6061；Copper：Copper pure iron | |
| Minimum finished aperture and tolerance | NPTH: 0.5±0.05mm; PTH (aluminum substrate, copper substrate): 0.3±0.1mm; PTH (cold plate, sintered plate, buried metal plate): 0.2±0.10mm; | |
| Shape processing accuracy | ±0.2mm | |
| PCB part surface treatment process | With/without lead spray tin; OSP; nickel (palladium) gold; electric (nickel) soft/hard gold; electroplated tin; nickel-free electroplated soft and hard gold; | |
| Metal surface treatment | Copper: nickel-plated gold; aluminum: anodizing, hard oxidation, chemical passivation; mechanical treatment: dry sandblasting, drawing | |
| Metal based material | Quanbao aluminum substrate (T-110, T-111); Tenghui aluminum substrate (VT-4A1, VT-4A2, VT-4A3); Laird aluminum substrate (1KA04, 1KA06); Berges metal substrate (MP06503 , HT04503); TACONIC metal substrate (TLY-5, TLY-5F); | |
| Thermal paste thickness (medium layer) | 75-150um | |
| Buried copper block size | 3*3mm—70*80mm | |
| Buried copper block flatness (difference accuracy) | ±40um | |
| Buried copper block to hole wall distance | ≥12mil | |
| Thermal Conductivity | 0.3-3W/m.k (aluminum substrate, copper substrate, cold plate); 8.33 W/m.k (sintered plate); 0.35-30 W/m.k (buried metal plate); 24-180 W/m.k (ceramic plate); | |
| product type | Rigid plate | Backplane, HDI, multi-layer buried blind hole, thick copper plate, power thick copper, semiconductor test board |
| Lamination method | Multiple compression blind buried plate | The same surface is pressed ≤3 |
| HDI board type | 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (buried hole ≤0.3mm in n), laser blind hole can be plated and filled | |
| Local mixed pressure | Minimum distance of mechanical drilling to conductor in local mixed zone | ≤10 layers: 14mil; 12 layers: 15mil; >12 layers: 18mil |
| Minimum distance from the local mixed pressure junction to the borehole | ≤12 layers: 12mil;>12 layers: 15mil | |
| Surface treatment | Lead-free | Electroplated copper nickel gold, immersion gold, hard gold plating (with/without nickel), gold-plated fingers, lead-free tin, OSP, chemical nickel palladium gold, soft gold plating (with/without nickel), immersion silver, sink tin, ENIG +OSP, ENIG+G/F, full plate gold plating + G/F, sinking silver + G/F, sinking tin + G / F |
| Leaded | Lead spray tin | |
| Thickness to diameter ratio | 10:1 (lead/lead-free spray tin, chemical nickel-plated gold, immersion silver, immersion tin, chemical nickel-palladium); 8:1 (OSP) | |
| Processing size (MAX) | Shen Jin: 520*800mm, vertical sinking tin: 500*600mm, horizontal tin: less than 500mm on one side; horizontal sinking silver: less than 500mm on one side; lead/lead-free spray tin: 520*650mm; OSP: less than one side 500mm; electroplated hard gold: 450*500mm; no more than 520mm on one side | |
| Processing size (MIN) | Shen tin: 60*80mm; immersion silver: 60*80mm; lead/lead-free spray tin: 150*230mm; OSP: 60*80mm; smaller than the above size | |
| Processing plate thickness | Shen Jin: 0.2-7.0mm, Shenyang Tin: 0.3-7.0mm (vertical sinking tin wire), 0.3-3.0mm (horizontal wire); immersion silver: 0.3-3.0mm; lead/lead-free spray tin: 0.6-3.5mm ; 0.4mm below the tin plate needs to be reviewed; OSP: 0.3-3.0mm; electroplated hard gold: 0.3-5.0mm (thickness ratio 10:1) | |
| Immersed gold plate IC minimum spacing or PAD to line minimum spacing | 3mil | |
| Gold finger height is the largest | 1.5inch | |
| Minimum spacing between gold fingers | 6mil | |
| Segmented gold finger minimum segment spacing | 7.5mil | |
| Surface treatment | Spray tin | 2-40um (the thinnest thickness of lead-spray tin tin is 0.4um, the thinnest thickness of lead-free tin-plated tin is 1.5um) |
| OSP | Film thickness: 0.2-0.4um | |
| Chemical nickel-plated gold | سمك النيكل: 3-5um ؛ سمك الذهب: 1-3 بوصة ، ≥ 3 بوصة تحتاج إلى المراجعة | |
| الفضة الغمر الكيميائي | 6-12 بوصة | |
| القصدير الكيميائي | سمك القصدير ≥1um | |
| الذهب الصلب المطلي بالكهرباء | 2-50 بوصة | |
| طلاء الذهب الناعم | سمك الذهب 0.10-1.5 ميكرومتر (عملية طلاء الفيلم الجاف) ، سمك الذهب 0.10-4.0 ميكرومتر (عملية طلاء الفيلم غير الجاف) | |
| النيكل البلاديوم الكيميائي | NI: 3-5um ، Pd ، 1-6uinch ، Au ، 1-4uinch | |
| النيكل البلاديوم الكيميائي | سمك الذهب 0.025-0.10um ، سمك النيكل ≥3um ، سمك النحاس الأساسي بحد أقصى 1OZ | |
| اصبع الذهب مطلي بالنيكل الذهب | سمك الذهب 1-50 بوصة (القيمة المطلوبة تشير إلى أنحف نقطة) ، سمك النيكل ≥ 3um | |
| زيت الكربون | 10-50 ميكرومتر | |
| زيت أخضر | زيت الغطاء النحاسي (10-18 ميكرومتر) ، زيت الغطاء العلوي (5-8 ميكرومتر) ، زاوية الخط ≥5 ميكرومتر (طبعة واحدة ، سمك النحاس 48 ميكرومتر أو أقل) | |
| الغراء الأزرق | 0.20-0.80 ملم | |
| حفر | 0.1 / 0.15 / 0.2mm أقصى سمك للحفر الميكانيكي | 0.8 مم / 1.5 مم / 2.5 مم |
| فتحة الحفر بالليزر هي الأصغر | 0.1 ملم | |
| Laser drilling aperture is the largest | 0.15 ملم | |
| Mechanical hole diameter (finished product) | 0.10-6.2mm (corresponding to the drill 0.15-6.3mm) | |
| PTFE material (including mixed pressure) board minimum finished hole diameter 0.25mm (corresponding to drill 0.35mm) | ||
| Mechanical buried blind hole diameter ≤0.3mm (corresponding to drill 0.4mm) | ||
| The hole diameter of the green hole plug hole in the disk is ≤0.45mm (corresponding to the drill 0.55mm) | ||
| The minimum aperture of the hole is 0.35mm (corresponding to the drill 0.45mm) | ||
| Metallized half hole aperture minimum 0.30mm (corresponding to drill 0.4mm) | ||
| Through hole plate thickness to diameter ratio maximum | 20:1 (excluding ≤0.2mm tool diameter; >12:1 to be evaluated) | |
| Laser drilling depth aperture ratio maximum | 1：1 | |
| Mechanically controlled deep drilling blind hole depth aperture ratio maximum | 1.3: 1 (فتحة ≤0.20 مم) ، 1.15: 1 (قطر المسام ≥0.25 مم) | |
| حفر عميق يتم التحكم فيه ميكانيكيًا (حفر خلفي) بأقل عمق | 0.2 مم | |
| الحفر - الحفر الميكانيكي للوصول إلى أدنى مسافة للموصل (لوحة ثقب عمياء غير مدفونة وثقب ليزر من الدرجة الأولى) | 5.5 مل (≤8 طبقات) ؛ 6.5 مل (10-14) ؛ 7 ميل (> 14 طبقة) | |
| الحفر - الحفر الميكانيكي للوصول إلى أدنى مسافة للموصل (لوحة عمياء مدفونة ميكانيكيًا وثقب أعمى مدفون بالليزر من الدرجة الثانية) | 7 مل (الضغط الأساسي) ؛ 8 مل (مكبس ثانوي) ؛ 9 مل (ثلاث مكابس) | |
| الحفر - الحفر الميكانيكي إلى أدنى مسافة للموصل (ثقب مدفون بعمى الليزر) | 7mil (1 + N + 1) ؛ 8 مل (1 + 1 + N + 1 + 1 أو 2 + N + 2) | |
| الحفر - حفر بالليزر إلى الحد الأدنى لمسافة الجسم للموصل (1 ، لوح HDI من الدرجة الثانية) | 5 ميل | |
| الحفر - أصغر مسافة بين جدران فتحات الشبكة المختلفة (بعد التعويض) | 10 ميل | |
| Drilling – the smallest distance between the same network hole walls (after compensation) | 6mil (through hole; laser blind hole); 10mil (mechanical blind buried hole) | |
| Drilling – the minimum distance between non-metallic hole walls (after compensation) | 8 ميل | |
| Drilling – hole tolerance (compared to CAD data) | ±2mil | |
| Drilling – NPTH hole diameter tolerance is minimal | ±2mil | |
| Drilling – solderless device hole aperture accuracy | ±2mil | |
| Drilling – Conical Hole Depth Tolerance | ±0.15mm | |
| Drilling-conical hole orifice diameter tolerance | ±0.15mm | |
| Pad (ring) | The inner and outer pads of the laser hole are the smallest | 10mil (4mil laser hole), 11mil (5mil laser hole) |
| Minimum size of inner and outer pads in mechanical vias | 16mil (8mil aperture) | |
| BGA pad diameter is the smallest | Lead-spray tin process 10mil, lead-free tin-spray process 12mil, other processes 7mil | |
| Pad tolerance (BGA) | +/-1.2mil (pad <12mil); +/-10% (pad ≥12mil) | |
| Line width/pitch | Limit line width corresponding to copper thickness | |
| 1/2OZ：3/3mil | ||
| 1OZ: 3/4mil | ||
| 2OZ: 5/5mil | ||
| 3OZ: 7/7mil | ||
| 4OZ: 12/12mil | ||
| 5OZ: 16/16mil | ||
| 6OZ: 20/20mil | ||
| 7OZ: 24/24mil | ||
| 8OZ: 28/28mil | ||
| 9OZ: 30/30mil | ||
| 10OZ: 32/30mil | ||
| Line width tolerance | ≤10mil：+/-1.0mil | |
| ＞10mil：+/-1.5mil | ||
| Solder mask character | Soldering plug hole maximum drilling diameter (two sides cover oil | 0.5mm |
| Solder mask ink color | yellow, black, blue, red, white, purple, matte green, dumb oil black, high refractive white oil | |
| Character ink color | White, yellow, black | |
| Blue rubber aluminum plate plug hole diameter | 5mm | |
| Resin plug hole drilling aperture range | 0.1-1.0mm | |
| Resin plug hole thickness to diameter ratio | 12：1 | |
| Solder solder bridge minimum width | Green oil 4mil, variegated 6mil control soldering bridge requires special requirements | |
| Minimum character line width | شخصية بيضاء 3mil ارتفاع 24mil ؛ الطابع الأسود 5mil ارتفاع 32mil | |
| الحد الأدنى من تباعد الكلمات المجوفة | عرض أجوف 8mil ارتفاع 40mil | |
| قناع اللحيم | عرض أجوف 8mil ارتفاع 40mil | |
| شكل | لا يتسرب V-CUT من خط الوسط النحاسي إلى مسافة الرسم | H ≤ 1.0 مم: 0.3 مم (20 درجة تعني زاوية V-CUT) ، 0.33 مم (30 درجة) ، 0.37 مم (45 درجة) ؛ |
| 1.0 ＜ H≤1.6mm: 0.36 ملم (20 درجة) 0.4 ملم (30 درجة) 、 0.5 ملم (45 درجة) ؛ | ||
| 1.6 ＜ H≤2.4 ملم: 0.42 ملم (20 درجة) 、 0.51 ملم (30 درجة) 、 0.64 ملم (45 درجة) ؛ | ||
| 2.4＜H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°); | ||
| تحمل تناسق V-CUT | ± 4 ميل | |
| أكبر عدد من خطوط V-CUT | 100 | |
| التسامح الزاوي V-CUT | ± 5 درجة | |
| مواصفات زاوية V-CUT | 20 ، 30 ، 45 درجة | |
| زاوية شطب إصبع الذهب | 20-30-45 درجة | |
| تسامح زاوية شطب الإصبع الذهبية | ± 5 درجات | |
| الحد الأدنى للمسافة من TAB إلى الإصبع الذهبي | 6 مم | |
| أدنى مسافة بين جانب الإصبع الذهبي وحافة المظهر الجانبي | 8 ميل | |
| التحكم في دقة عمق الأخدود العميق (الحافة) （NPTH） | ± 0.10 مم | |
| دقة الأبعاد (من الحافة إلى الحافة) | ± 8 ميل | |
| التسامح فتحة فتحة الطحن （PTH） | عرض الأخدود وطول الأخدود ± 0.15 مم | |
| التسامح فتحة فتحة الطحن （NPTH） | عرض الأخدود وطول الأخدود ± 0.10 مم | |
| فتحة الحفر أدنى تفاوت （PTH） | اتجاه عرض الأخدود ± 0.075 مم ؛ طول الفتحة / عرض الفتحة <2: اتجاه طول الفتحة +/- 0.1 مم ؛ طول الفتحة / عرض الفتحة ≥2: اتجاه طول الفتحة +/- 0.075 مم | |
| فتحة الحفر أدنى تفاوت NPTH） | ± 0.05 مم في اتجاه عرض الأخدود ؛ طول الأخدود / عرض الفتحة <2: اتجاه طول الأخدود +/- 0.075 مم ؛ طول الأخدود / عرض الفتحة ≥2: اتجاه طول الأخدود +/- 0.05 مم |