Big PCB Manufacturer & Assembly - Service aus einer Hand

CCL ist auch als Substrat bekannt. Ein plattenförmiges Material, das durch Eintauchen eines Verstärkungsmaterials in Harz erhalten wird. Dann wird eine Kupferfolie auf einer oder beiden Seiten beschichtet und das Heißpressen wird als kupferkaschiertes Laminat bezeichnet. Es ist das Grundmaterial für Leiterplatten, das oft als Substrat ( große ) bezeichnet wird. Wenn es bei der Herstellung von mehrschichtigen Platten verwendet wird, wird es auch als CORE bezeichnet.

CCL ist das Grundmaterial der Elektronikindustrie. Es wird hauptsächlich zur Herstellung von Leiterplatten verwendet. Es ist weit verbreitet in Fernsehgeräten, Radios, Computern, Computern, Mobilkommunikation und anderen elektronischen Produkten.

Since the manufacture of PCB is in the latter half of the manufacture of electronic devices, it is called the downstream industry of the electronics industry. Almost all electronic devices require PCB support, so PCBs are the world’s most market share of electronic components. At present, Japan, China, Taiwan, Western Europe, and the United States are the main PCB manufacturing bases.

What is the Chinese name of the PCB?

The Chinese name is a printed circuit board, also known as a PCB. It is an important electronic component and is the support of electronic components. Also a carrier for the electrical connection of electronic components. Because it is made by electronic printing, it is called a “printing” circuit board.

After the electronic equipment adopts the printed board, due to the consistency of the same printed board, the manual wiring is avoided. Meanwhile, the electronic components can be automatically inserted or mounted, automatically soldered, and automatically detected to ensure the quality of the electronic equipment. Increase labor productivity, reduce costs, and facilitate maintenance.

Printed boards have evolved from single layers to double-sided, multi-layer and flexible, and still maintain their respective trends. Due to the continuous development of high precision, high density, and high reliability, the volume is reduced, the cost is reduced, and the performance is improved, so that the printed board still maintains a strong vitality in the development of electronic equipment in the future.

The domestic and international discussion on the future development trend of printed board manufacturing technology is basically the same, that is, high density, high precision, fine aperture, fine wire, fine pitch, high reliability, multi-layer, high-speed transmission, lightweight. The development of thin-type direction, in the production at the same time to improve productivity, reduce costs, reduce pollution, adapt to the development of multi-variety, small-volume production. The technical development level of printed circuits is generally represented by the line width, aperture, and plate thickness/aperture ratio on the printed board.

Where is the big pcb generally used?

Application areas: smartphones, touch panels, computers, e-books, digital cameras, LCD TVs, LED lighting, etc.

Wenn ein Kunde ein großformatiges Board benötigt, können wir es auch produzieren. „Bei der großen Platine kann unsere große Platine 600 mm x 900 mm groß sein. Aufgrund der Größe der Platine steigen die Kosten für den Prüfstand und die Folie entsprechend. “