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FPGA BGA assembly patch manufacturer

Name: FPGA PCB assembly patch manufacturer

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone

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Name: FPGA PCB assembly patch manufacturer

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone

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Name: FPGA PCB assembly patch manufacturer

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone

Add Your Heading Text Here

Name: FPGA PCB assembly patch manufacturer

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone

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Medical motherboard BGA assembly

FPGA BGA assembly patch manufacturer Name: FPGA PCB assembly patch manufacturer Number of SMT lines: 7 high-speed SMT patch supporting production lines…

FPGA BGA assembly patch manufacturer

FPGA BGA assembly patch manufacturer Name: FPGA PCB assembly patch manufacturer Number of SMT lines: 7 high-speed SMT patch supporting production lines…