PCB HDI

Fabricante y ensamblaje de PCB HDI: servicio integral

La PCB HDI se define como una micro vía con un diámetro de orificio de 6 milésimas de pulgada o menos y un diámetro de orificio de 0,25 mm o menos. La densidad de contacto es superior a 130 puntos / cuadrado y la densidad del cableado tiene un ancho / paso de línea de 3 mil / 3 mil o menos.

HDI Board

En general, HDI PCB tiene las siguientes ventajas:

1. Reducir el costo de la PCB: cuando la densidad de la PCB aumenta más allá de la placa de ocho capas, se fabricará en HDI y el costo será menor que el del complicado proceso tradicional de conformado a presión.

2. Increasing line density: The interconnection of traditional circuit boards and parts must be connected to the via conductors through the lines around the QFP, so these lines need to occupy some space. The micro-hole technology can hide the wiring required for the interconnection to the next layer, and the connection between the pads and the leads between different layers is directly connected by the blind holes in the pad, without QFP wiring. Therefore, some solder pads (such as mini-BGA or CSP ball soldering) can be placed on the outer surface to support more parts, which increases the density of the board.

3. Conducive to the use of advanced packaging technology: the general traditional drilling technology due to the size of the pad (through-hole) and mechanical drilling, and can not meet the needs of small parts of the new generation of fine lines. With advances in microtia technology, designers can design the latest high-density IC package technologies, such as Array package, CSP, and DCA (Direct Chip Attach) into the system.

4. Have better electrical performance and signal correctness: the use of micro-hole interconnection can reduce signal reflection and crosstalk between lines, and the circuit board design can add more space, due to micro-hole The physical structure is small and short, so the effect of inductance and capacitance can be reduced, and the switching noise during signal transmission can also be reduced.

5. Better reliability: Due to the thin thickness and the aspect ratio of 1:1, the micropores have higher reliability when transmitting signals than ordinary through holes.

6. Improves thermal properties: The insulating dielectric material of the HDI board has a higher glass transition temperature (Tg) and therefore has better thermal properties.

7. Improve RF interference / electromagnetic interference / electrostatic discharge (RFI / EMI / ESD): Micro-hole technology allows board designers to shorten the distance between the ground plane and the signal layer to reduce radio frequency interference and electromagnetic interference; Increase the number of grounding wires to avoid damage caused by momentary discharge of parts in the circuit due to static electricity.

8. Aumente la eficiencia del diseño: la tecnología de microagujeros permite que el circuito se organice en la capa interna, de modo que el diseñador del circuito tenga más espacio de diseño, por lo que la eficiencia del diseño de la línea puede ser mayor.

Solicitud:

Actualmente, HDI se usa ampliamente en teléfonos móviles, cámaras digitales (cámaras), MP3, MP4, computadoras portátiles, electrónica automotriz y otros productos digitales, entre los cuales los teléfonos móviles son los más utilizados.

Investigación


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