Kingford ajoute un système de détection aux rayons X et des connaissances liées aux rayons XPublié le 2019-12-26
Félicitation! Afin d'offrir aux clients une plus grande précision et de meilleurs services d'inspection, Kingford PCB ajoute un système d'inspection X-Ray viewX1800.
Comment fonctionne X - R ay ?
X-Ray is a high-performance detection device that uses a cathode ray tube to generate high-energy electrons to collide with a metal target. During the impact, the lost kinetic energy is released in the form of X-Ray due to sudden deceleration of electrons. For the position where the sample cannot be detected by the appearance, by using the change of the light intensity of the X-Ray after penetrating the different density substances, the contrast effect produced can form an image to display the internal structure of the object to be tested, and thus can be observing the problematic area inside the object to be tested while destroying the object to be tested.
Used for detection of defects and cracks in metal materials and parts, plastic materials and parts, electronic components, LED components, etc., internal displacement of BGA and circuit boards, and identification of empty welding, virtual welding, etc. BGA welding defects, microelectronic systems and sealing components, cables, fixtures, and internal analysis of plastic parts.
X-Ray Scope of application
- Automotive electronics
- BGA/QFN detection
- Aluminum die castings
- Molded plastic parts
- Electrical and mechanical components
- Biological agriculture seed
- Aviation component
- Tire wheel
- Harness / USB / plug
Why SCIENSCOPE View X1800?
1.Clear and undistorted image
Using the most advanced micro-focus spot X-ray tube & digital flat-panel detector, the latest upgraded image processing technology.
2.CNC step function & automatic detection and determination program
Greatly improve the detection capacity and reduce the labor cost
3.Detection screen center hold function
During tilt detection, the object to be detected is always at the center of the screen, and the magnification is always the same.
X-RAY detection technology has brought new changes to SMT production testing methods. It can be said that it is the most demanding manufacturer who is eager to further improve the SMT production process level, improve production quality, and will find circuit assembly failures in time. Good choice. With the development trend of SMT workshops, other assembly fault detection methods are difficult due to their limitations. X-RAY automatic inspection equipment will become the new focus of SMT production equipment and play an increasingly important role in the field of SMT production, as shown below.
1.Coverage of process defects is as high as 97%. Inspectable defects include: solder joints, bridging, soldering, insufficient solder, pores, device missing, and so on. In particular, X-RAY can also be inspected for solder joint hidden devices such as BGA and CSP.
2.Higher test coverage. The X-RAY inspection equipment in SMT can be inspected where it is not visible to the naked eye and online tests. For example, if PCBA is judged to be faulty, it is suspected that the inner layer of the PCB is broken, and X-RAY can be checked quickly.
3.The preparation time for testing is greatly reduced.
4.Defects that cannot be reliably detected by other test methods, such as: virtual soldering, air holes, and poor molding, can be observed.
5.Inspection equipment X-RAY requires only one inspection of double and multi-layer boards (with layering function)
6.Provide relevant measurement information to evaluate the production process in SMT. Such as the thickness of the solder paste, the amount of solder under the solder joints, and so on.
7.The X-ray inspection perspective can clearly see the three-dimensional structure of the SoC processor and the surrounding circuit board, especially the peripheral perforations. Provide sufficient basis for whether the welding is ok or false welding.
X-ray three-dimensional perspective imaging technology brings new changes to the electronic manufacturing quality inspection method. It is the best choice for manufacturers who further improve the production process level, improve production quality, and discover electronic assembly failures in time as a breakthrough. With the development trend of electronic packaging devices, other assembly fault detection methods are difficult due to their limitations. X-Ray three-dimensional imaging inspection equipment will become the new focus of electronic packaging device production equipment and play an irreplaceable role in its production field. effect.