Fabricant et assemblage de PCB épais - Service à guichet unique

Selon l'épaisseur du stratifié revêtu de cuivre, il peut être divisé en une carte PCB épaisse (0,8 à 3,2 mm (y compris Cu)) et une plaque mince (moins de 0,78 mm (à l'exclusion de Cu)). L'épaisseur du circuit imprimé normal est de 0,8 mm à 1,6 mm et notre plaque la plus épaisse peut avoir une épaisseur de 6,0 mm, et la tolérance est contrôlée par +/- 10%.

In addition, copper-clad laminates (CCL) are the raw materials for the electronics industry. The structure of the copper-clad laminate includes a substrate, copper foil, copper-clad laminate adhesive, and the like. It is a product made of wood pulp paper or fiberglass cloth as a reinforcing material, impregnated with resin, coated with copper foil on one or both sides, and hot pressed. The copper-clad laminate can be fabricated into a circuit board by engraving, hand drawing, mapping, mime printing, hot melt film making, precoating photosensitive copper plate, and thermal transfer method.

What are the substrates, copper foil, and CCL adhesives?

1. Substrate: The substrate of the copper-clad laminate requires an insulating laminate composed of a polymer synthetic resin and a reinforcing material. There are many types of synthetic resins, such as phenolic resins, epoxy resins, and polytetrafluoroethylene. Reinforcing materials generally have two kinds of paper and cloth, which determine the mechanical properties of the substrate, such as dipping resistance, bending strength and the like.

2. Copper foil: It is a key material for the manufacture of copper-clad laminates and must have high electrical conductivity and good weldability. Most importantly, there should be no scratches, blistering and wrinkles on the surface of the copper foil. Meanwhile, the purity of the metal is not less than 99.8%, and the thickness error is not more than ±5um.  According to the ministerial standards, the nominal series of copper foil thicknesses are 18, 25, 35, 70 and 105 um. China is currently gradually promoting the use of 35um thick copper foil. The thinner the copper foil, the easier it is to etch and drill. Ideal for manufacturing high-density plates with complex lines.

3. CCL adhesive: Adhesive is an important factor in whether the copper foil can be firmly covered on the substrate. The peel strength of a copper-clad depends primarily on the properties of the adhesive.

What are the two types of CCL (thick pcb)?

According to the different mechanical rigidity of CCL, it can be divided into rigid CCL et flexible CCL. Usually, the formation of rigid copper-clad laminates requires batch lamination. The process of forming a flexible copper clad laminate requires coating a polyimide or polyester film with copper foil. The finished product is very soft and has excellent folding resistance. In recent years, with the development of on-load semiconductor packages (TBA) and the like. In order to meet the needs of the organic resin ribbon package substrate, a thin copper-clad foil tape. Such as an epoxy resin-glass fiber cloth substrate or a liquid crystal polymer film. Form of the product.

Le stratifié revêtu de cuivre à base de résine fait référence à l'utilisation de résine sur le stratifié principal revêtu de cuivre. À l'heure actuelle, la résine principale la plus courante est une résine phénolique, une résine époxy (EP), une résine polyimide (PI), une résine polyester (PET), une résine polyphénylène éther (PPO) ou une résine cyanate (CE), une résine polytétrafluoroéthylène (PTFE), résine de maléimide triazine (BT).