Produsen & Perakitan Papan PCB OSP - Layanan satu atap

Papan OSP adalah perawatan permukaan foil tembaga PCB sesuai dengan persyaratan instruksi RoHS suatu proses. Ini disebut film solder organik, juga dikenal sebagai pelindung tembaga.

OSP adalah film organik yang ditanam secara kimiawi di atas permukaan tembaga yang bersih. Film ini tahan terhadap oksidasi, sengatan panas, dan kelembaban. Melindungi permukaan dari karat lebih lanjut (oksidasi atau vulkanisasi, dll.) Dalam kondisi normal. Ketebalan film umumnya dikontrol pada 0,2-0,5um.

OSP memiliki tiga kelas bahan utama: Rosin, Resin Aktif, dan Azole. Salah satu yang paling banyak digunakan adalah azole OSP.

Mengadopsi papan PCB OSP memiliki banyak manfaat sebagai berikut:

1. Simple process and processability: OSP circuit boards can be easily reprocessed by PCB manufacturers. So if the coating is found to be damaged, the PCB assembler can obtain a new coating.

2. Good wettability: OSP coated plate performs better in solder wetting when flux encounters holes and pads.

3. Environmental protection: since water-based compounds are used in the formation of OSP, they do no harm to our environment and only fall into people’s expectations of the green world.

Therefore, OSP is a better choice for electronic products applicable to green laws such as RoHS.

4. Cost-effective: the cost of various surface treatments for OSP is significant due to the simplicity of the compounds used in the OSP generation and the simplicity of the manufacturing process. It costs less, resulting in lower circuit board costs.

5. Reflow welding for two-side SMT assembly: with the continuous development and progress of OSP, it has been accepted from single-side SMT assembly to two-side SMT assembly, greatly expanding its application field.

6. Low requirements for solder ink

Of course, OSP also has its disadvantages:

1. The protective film formed by the OSP process is extremely thin and easy to scratch (or scratch), which must be carefully operated and operated.

2. The 0SP film (refers to the OSP film on the connection disc without welding) after several high-temperature welding processes will have discoloration or crack, which will affect the weldability and reliability.

3. Solder paste printing I art should be mastered well because the plate with poor printing cannot be cleaned with IPA, which will damage the OSP layer.

4. Tidaklah mudah untuk mengukur ketebalan lapisan 0SP transparan dan non logam, dan tidak mudah untuk melihat derajat cakupan transparansi pada lapisan tersebut, sehingga sulit untuk mengevaluasi stabilitas kualitas pemasok dalam aspek berikut:

Meskipun OSP bukanlah pilihan yang paling sempurna, kesederhanaan dan biaya rendah OSP menjadikannya favorit di industri.