セラミックPCBの製造と応用

セラミックPCBメーカーの製造と応用

Ceramic substrate refers to a special process board where copper foil is directly bonded to the surface (single-sided or double-sided) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The manufactured ultra-thin composite substrate has excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can etch out various patterns like a PCB board, and has a large current carrying capacity. ability. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology.

Features: strong mechanical stress, stable shape; high strength, high thermal conductivity, high insulation; strong binding force, anti-corrosion.

Good thermal cycling performance, with 50,000 cycles, high reliability.

Like PCB board (or IMS substrate), it can etch a variety of graphic structures; no pollution, no pollution.

The operating temperature is wide -55 ℃ ～ 850 ℃; the thermal expansion coefficient is close to silicon, which simplifies the production process of power modules.

At this stage, there are five types of ceramic heat sink substrates: HTCC, LTCC, DBC, DPC, and LAM. HTCC \ LTCC all belong to the sintering process and the cost will be higher.

However, DBC and DPC are developed in China in recent years and are professional technologies for energy production. DBC uses high temperature heating to combine Al2O3 and Cu plates. The technical bottleneck is that it is difficult to solve the problem of micro pores between Al2O3 and Cu plates This makes the product’s mass production energy and yield rate more challenging, while DPC technology uses direct copper plating technology to deposit Cu on the Al2O3 substrate. Its process combines materials with thin film process technology. Its products are The most commonly used ceramic heat sink substrate in recent years. However, its ability to integrate material control and process technology is relatively high, which makes the technical threshold for entering the DPC industry and stable production relatively high. LAM technology is also known as laser rapid activation metallization technology.

1.HTCC（高温同時焼成セラミック）

HTCCは高温同時焼成多層セラミックとも呼ばれます。 製造プロセスはLTCCと非常によく似ています。 主な違いは、HTCCセラミック粉末がガラス材料に添加されていないことです。 そのため、HTCCは1300〜1600℃の高温で乾燥・硬化させる必要があります。 次に、緑色の胚にビアが開けられ、穴とプリント回路がスクリーン印刷技術で埋められます。 同時焼成温度が高いため、金属導体材料の選択は制限されています。 主な材料は高融点ですが導電性ですが、タングステン、モリブデン、マンガンなどの特性の悪い金属を最終的に積層して焼結します。

2.LTCC（低温同時焼成セラミック）

LTCCは低温同時焼成多層セラミック基板としても知られています。 この技術では、最初に無機アルミナ粉末と約30％から50％のガラス材料と有機バインダーを加えて均一に混合し、次にスクレーパーを使用してスラリーをシート状に削り、次にシートスラリーを加える必要があります。は、乾燥工程を経て薄い緑色の胚片に成形され、各層の信号伝達として各層の設計に従って貫通穴が開けられます。 LTCC内部回路スクリーン印刷技術は、生胚の穴とプリント回路を埋めるために使用されます。 内部電極と外部電極は、銀、銅、金、その他の金属で作ることができます。 最後に、層をラミネートし、850〜900°Cに配置します。焼結炉での焼結を完了することができます。

3.DBC（直接結合銅）

Direct copper deposition technology uses copper’s oxygen-containing eutectic solution to directly apply copper to ceramics. The basic principle is to introduce an appropriate amount of oxygen between copper and ceramics before or during the bonding process, at 1065 ℃ ~ 1083. In the range of ℃, copper and oxygen form a Cu-O eutectic liquid. DBC technology uses this eutectic liquid to react with the ceramic substrate to generate CuAlO2 or CuAl2O4 phase on the one hand, and infiltrate the copper foil to achieve the combination of the ceramic substrate and the copper plate.

DPC production process of alumina and aluminum nitride ceramic substrates.