多層FPGAPCB（Field Programmable Gate Array）は、PALやGALなどのプログラマブルデバイスに基づくさらなる開発の製品です。 これは、特定用途向け集積回路（ASIC）の分野ではセミカスタム回路として登場し、カスタム回路の欠点を解決するだけでなく、元のプログラマブルデバイスの限られた数のゲート回路の欠点も克服します。
Multilayer FPGA PCB design is not a simple chip research. It is mainly to use FPGA mode to design products in other industries. Unlike ASICs, FPGAs are widely used in the communications industry. Through the analysis of the global FPGA product market and related suppliers, combined with the actual situation in China and the leading domestic FPGA products, we can find out the future development direction of related technologies, which has a very important role in promoting the overall improvement of China’s science and technology level.
Compared with the traditional chip design, FPGA chips are not limited to research and design chips, but can be optimized by using specific chip models for products in many fields. From the perspective of the chip device, the FPGA itself constitutes a typical integrated circuit in a semi-custom circuit, which contains a digital management module, an embedded unit, an output unit, and an input unit. On this basis, it is necessary for FPGA chips to comprehensively focus on comprehensive chip optimization design, and to improve the current chip design to add new chip functions, thereby simplifying the overall structure of the chip and improving performance.
First we look at the PCB parameters:
Board thickness: 3.4mm
Material: Panasonic Metron6 R-5775k
Panasonic Metron6 R-5670k