반도체 테스트 보드 (로드 보드)

4 개의 PCB를 지원하는 반도체 테스트 보드

프로브 카드는 CP 테스트에서 테스터와 다이의 패드를 연결하는 데 사용됩니다. 일반적으로 Loadboard의 물리적 인터페이스로 사용됩니다. 경우에 따라 ProbeCard는 소켓 또는 기타 인터페이스 회로를 통해로드 보드에 연결됩니다. 적용 : 웨이퍼 절단 전에 PC를 통해 웨이퍼의 품질을 테스트하여 불량 포장 비용을 방지 할 수 있습니다.

The test load board is a mechanical and circuit interface that connects the test equipment to the device under test. It is mainly used in the yield test of the semiconductor manufacturing back-end IC package. Through this stage of testing, defective functions can be eliminated. IC, to avoid subsequent scrap of electronic products due to bad ICs. The test load board is divided into 93K series, T2000 series, TUF series and so on according to the test platform.

BIB (BURN IN BOARD, burn-in test board), the IC that completes the package test burn-in test under specific conditions and time to verify the reliability of the IC. BIB is a PCB board used for IC burn-in testing.

Interposer Board: The signal of the Probe card is converted by the interposer interlayer so that the Probe head probe can receive the signal, and it can also smoothly transmit the signal to the test machine for interpretation.

This article only talks about Loadboard

Example: 38L Loadboard

Number of layers: 38L
Board thickness: 6.35mm
Material: TU872SLK
Thickness to diameter ratio: 30: 1
Resin plug hole, plating fill
Surface treatment: whole board 30U “+ partial OSP
Special: PTH countersink
Size: 768 * 570mm
Tested object: 0.2mm
Existing production capacity:

Lamination (PIN-LAM): Multilayer High-Speed FPGA PCB Production Technology Article
PTH: High-thickness-to-diameter copper-filled hole filling technology

PTH countersink

Board thickness comparison: the top is a 1.6mm dual panel, the lower four are Probecard and Loadboard

Difficulty summary:
As ICs become more and more sophisticated, more and more functions need to be tested, and the number of layers of test boards is getting thicker and larger.
First, the lamination offset
Second, ultra-high thickness-diameter ratio
Three, large size resin plug hole
Fourth, a variety of selective surface methods.