다층 고속 FPGA PCB 생산 기술

다층 FPGA PCB 소개

Multilayer FPGA PCB (Field Programmable Gate Array)는 PAL 및 GAL과 같은 프로그래밍 가능 장치를 기반으로 한 추가 개발 제품입니다. 주문형 회로의 단점을 해결할뿐만 아니라 원래 프로그램 가능한 장치의 제한된 수의 게이트 회로의 단점을 극복하는 ASIC (application-specific integrated circuits) 분야에서 반 주문형 회로로 나타납니다.

Multilayer FPGA PCB design is not a simple chip research. It is mainly to use FPGA mode to design products in other industries. Unlike ASICs, FPGAs are widely used in the communications industry. Through the analysis of the global FPGA product market and related suppliers, combined with the actual situation in China and the leading domestic FPGA products, we can find out the future development direction of related technologies, which has a very important role in promoting the overall improvement of China’s science and technology level.

Compared with the traditional chip design, FPGA chips are not limited to research and design chips, but can be optimized by using specific chip models for products in many fields. From the perspective of the chip device, the FPGA itself constitutes a typical integrated circuit in a semi-custom circuit, which contains a digital management module, an embedded unit, an output unit, and an input unit. On this basis, it is necessary for FPGA chips to comprehensively focus on comprehensive chip optimization design, and to improve the current chip design to add new chip functions, thereby simplifying the overall structure of the chip and improving performance.

First we look at the PCB parameters:
Layers: 32L
Board thickness: 3.4mm
Material: Panasonic Metron6 R-5775k
Panasonic Metron6 R-5670k