Teknologi pengeluaran FPGA PCB berkelajuan tinggi pelbagai lapisan

Dihantar pada 2020-03-03

Pengenalan FPGA PCB pelbagai lapisan

Multilayer FPGA PCB (Field Programmable Gate Array) adalah produk pengembangan seterusnya berdasarkan peranti yang dapat diprogramkan seperti PAL dan GAL. Ia muncul sebagai litar separa ubahsuaian dalam bidang litar bersepadu khusus aplikasi (ASIC), yang tidak hanya menyelesaikan kekurangan litar khusus, tetapi juga mengatasi kekurangan bilangan litar gerbang terhad dari peranti yang dapat diprogramkan asal.

Multilayer FPGA PCB design is not a simple chip research. It is mainly to use FPGA mode to design products in other industries. Unlike ASICs, FPGAs are widely used in the communications industry. Through the analysis of the global FPGA product market and related suppliers, combined with the actual situation in China and the leading domestic FPGA products, we can find out the future development direction of related technologies, which has a very important role in promoting the overall improvement of China’s science and technology level.

Compared with the traditional chip design, FPGA chips are not limited to research and design chips, but can be optimized by using specific chip models for products in many fields. From the perspective of the chip device, the FPGA itself constitutes a typical integrated circuit in a semi-custom circuit, which contains a digital management module, an embedded unit, an output unit, and an input unit. On this basis, it is necessary for FPGA chips to comprehensively focus on comprehensive chip optimization design, and to improve the current chip design to add new chip functions, thereby simplifying the overall structure of the chip and improving performance.

First we look at the PCB parameters:
Layers: 32L
Board thickness: 3.4mm
Material: Panasonic Metron6 R-5775k
Panasonic Metron6 R-5670k