Wat is PCB-gemiddelde？

De printplaten, is een afkorting voor Printed Circuit Board, ook wel printplaat en printplaat genoemd. Het is een belangrijke elektronische component, een ondersteuning voor elektronische componenten en een aanbieder van elektrische verbindingen voor elektronische componenten. Omdat het is gemaakt door middel van elektronisch afdrukken, wordt het een "gedrukte" printplaat genoemd.

PCB-geschiedenis

The inventor of the printed circuit board was the Austrian Paul Eisler (Paul Eisler), who used a printed circuit board in a radio device in 1936. In 1943, Americans used this technology extensively in military radios. In 1948, the United States officially recognized the invention for commercial use. Printed circuit board technology has only been widely adopted since the mid-1950s.

Before the advent of printed circuit boards, the interconnection between electronic components was realized by direct connection of wires. Nowadays, the circuit panel only exists as an effective experimental tool; the printed circuit board has occupied an absolute dominant position in the electronics industry.

PCB-ontwerp

The design of the printed circuit board is based on the circuit schematic diagram to realize the functions required by the circuit designer. The design of the printed circuit board mainly refers to the layout design, which needs to consider various factors such as the layout of external connections, the optimal layout of internal electronic components, the optimal layout of metal wiring and through holes, electromagnetic protection, heat dissipation, and so on. Excellent layout design can save production costs and achieve good circuit performance and heat dissipation performance. Simple layout design can be realized by hand, and complex layout design needs to be implemented with the aid of computer-aided design (CAD).

PCB classification

Classified according to the number of circuit layers: divided into single panel, double panel and multilayer board. Common multi-layer boards are generally 4-layer boards or 6-layer boards, and complex multi-layer boards can reach more than ten layers.

Classified according to soft and hard: divided into ordinary circuit board and flexible circuit board.

The raw material of PCB: copper-clad laminate is the substrate material for making printed circuit boards. It is used to support various components, and can achieve electrical connection or electrical insulation between them.

PCB industry chain

Classified according to the upstream and downstream of the industrial chain, it can be divided into raw materials-copper clad laminate-printed circuit board-electronic product applications, and the relationship is simply expressed as:

Fiberglass cloth: Fiberglass cloth is one of the raw materials of copper clad laminate. It is woven from glass fiber yarn, which accounts for about 40% (thick sheet) and 25% (thin sheet) of the cost of copper clad laminate. The glass fiber yarn is calcined into liquid form in the kiln by silica sand and other raw materials. It is drawn into a very fine glass fiber through a very small alloy nozzle, and then hundreds of glass fibers are twisted into a glass fiber yarn. The investment in kiln construction is huge, generally requiring hundreds of millions of dollars, and once the ignition has to be produced 24 hours a day, the cost of entry and exit is huge. The manufacture of fiberglass cloth is similar to that of weaving companies. It can control the production capacity and quality by controlling the speed, and the specifications are relatively simple and stable. Since World War II, there have been few major changes in specifications. Unlike CCL, the price of fiberglass cloth is most affected by supply and demand. At present, the production capacity of Taiwan and Mainland China accounts for about 70% of the world.

Koperfolie: Koperfolie is de grondstof die verantwoordelijk is voor het grootste deel van de kosten van met koper bekleed laminaat, goed voor ongeveer 30% (dikke plaat) en 50% (dunne plaat) van de kosten van met koper bekleed laminaat. Daarom is de prijsstijging van koperfolie de belangrijkste drijvende kracht achter de prijsstijging van met koper bekleed laminaat. De prijs van koperfolie wordt nauw weerspiegeld in de prijsverandering van koper, maar de onderhandelingspositie is zwak. De laatste tijd, met de stijgende prijs van koper, bevinden koperfoliefabrikanten zich in een moeilijke situatie. Veel bedrijven worden gedwongen hun deuren te sluiten of te fuseren, zelfs als fabrikanten met koperbekleding koperfolie accepteren. Alle koperfoliefabrikanten verkeren nog steeds in een algemene verliesstaat met stijgende prijzen.

Met koper bekleed laminaat: het met koper beklede laminaat is een product dat wordt verkregen door glasvezeldoek en koperfolie samen te persen met epoxyhars als een smeltmiddel. Het is een directe grondstof van PCB. Na het etsen, galvaniseren en meerlaagse plaatlaminering wordt een printplaat gemaakt. bord. De vraag naar fondsen in de CCL-industrie is niet groot, ongeveer 30-40 miljoen yuan, en de productie kan op elk moment worden stopgezet of overgedragen. In de stroomopwaartse en stroomafwaartse ketenstructuur van de industrie heeft CCL de sterkste onderhandelingspositie. Het heeft niet alleen een sterke zeggenschap over de aankoop van grondstoffen zoals glasvezeldoek en koperfolie, maar zolang de stroomafwaartse vraag acceptabel is, kan het de druk van de stijgende kosten doorstaan. Stroomafwaartse PCB-fabrikanten.

Ontwikkelingsstatus van de PCB-industrie

From the perspective of output composition, the main products of China’s PCB industry have shifted from single-sided and double-sided boards to multi-layer boards, and are being upgraded from 4-6 layers to 6-8 layers or more. With the rapid growth of multilayer boards, HDI boards, and flexible boards, my country’s PCB industry structure is gradually being optimized and improved.

However, although my country’s PCB industry has made great progress. But there is still a big gap compared with advanced countries, and there is still much room for improvement and improvement in the future. First of all, my country entered the PCB industry late, and there is no special PCB R&D institution. There is a big gap with foreign manufacturers in some new technology R&D capabilities. Secondly, in terms of product structure, the production of medium and low-level boards is still the main factor. Although FPC and HDI have grown rapidly, the proportion is still not high due to the small base. Third, most of my country’s PCB production equipment depends on imports, and some core raw materials can only rely on imports. The incomplete industrial chain also hinders the development of domestic PCB series enterprises.

At present, the output value of the global PCB industry accounts for more than a quarter of the total output value of the electronic component industry, and it is the industry with the largest proportion in each electronic component subdivision industry. At the same time, due to its unique position in the basic electronic industry, it has become the most active industry in the contemporary electronic component industry.