PCB Manufacture China Factory – Proto, Small Run, Batch Run

Posted on 2020-09-22

 PCB Manufacture China Factory – Proto, Small Run, Batch Run

PCBs or Printed Circuit Boards are the spine of most of the electronics. You will find them in almost all the computational electronics. These can be simple devices such as calculators and Digital clocks. When you take apart any electronic device, you are sure to notice a small board that is green with markings in the form of a maze. This small board is a PCB, and the maze is a circuit. What does PCB do? Why do you need a PCB in a device? Let’s take a look at these aspects and step by step of PCB manufacturing.

PCB Manufacture China Factory


PCB makes the functioning of electronic devices possible without which it cannot be operated. A PCB links all the internal components through a circuit for the device to operate appropriately. A PCB transfers electrical signals via internal components. In short, a PCB directs the electricity to a channeling route to bring the electronic device to life. It has a network of copper routes that determines the role of each part of a PCB.

PCB Manufacturing is extensive and has a number of steps to get in form.


* The Design
* Design Printing
* Substrate creation
* The Inner Layers printing
* UV Light
* Eliminating Unwanted Copper
* Inspection
* Layers lamination
* Pressing Layers
* Drilling & Plating
* Imaging of Outer Layer
* Plating & Etching
* Application of Solder Mask
* Silk screening
* Finishing of Surface
* Testing
* Proofing & V-scoring

PCBs are made from copper, which is plated according to the requirements. The plating is done on a substrate that is etched away to reveal the board design. For a secure fit, the layers have to be bonded by lining them up.


THE DESIGN- A board design has to be finalized to start its manufacturing process. A blueprint is created that acts as a base for this process. This design is finished through computer software. Internal and external layers details are obtained, making use of a trace width calculation.

DESIGN PRINTING- A plotted printer is employed to print the PCB design. It generates a film that provides details and board layers. During printing, two colors of ink are employed on the internal board layer. For non-conductive regions, clear ink is used, while for conductive copper circuits and traces, black ink is used. For outer layers, the same ink colors are used in reverse.

SUBSTRATE CREATION– The substrate used is a glass fiber and epoxy resin for insulation. This layer holds the structural components by semicuring the material in an oven. The pre-bonding of copper is done on either side of the layer. This is later etched away to reveal the design of the printed film.

THE INNER LAYERS PRINTING– The printed design has to be laminated to form the body. A film created from a photo-reactive substance is hardened by exposing it to UV light. This covers the entire structure and aligns the actual board print and blueprints. For aligning, PCB is drilled for holes.

UV LIGHT– The photoresist is hardened by exposing it to UV lights after alignment. An alkaline wash is done for the board to eliminate the extra photoresist.

ELIMINATING UNWANTED COPPER– Extra copper on the board is removed with the help of a chemical solution that eats the extra copper away.

INSPECTION– The cleaned layers undergo inspection to check for alignment. The inner and outer layers are aligned by drilling a pin through the earlier drilled holes with an optical punch. Another device inspects to ensure no defects.

LAYERS LAMINATION– Layers are held together with metallic clamps and then appropriately laminated. Epoxy resin is applied to the alignment basin and substrate layer over this layer. Followed is the layer of copper foil and then more epoxy resin. Another copper layer called the press plate is finally applied.

PRESSING LAYERS– To pack all the layers, a mechanical press is used. Drill pins are punched for properly securing and aligning the layers. Pressure and heat is applied to the layers for lamination. The layers are fused because of the melting of the epoxy resin layer in between.

DRILLING & PLATING– A computer-aided drill is employed for holes. The inner panels and substrate are exposed. The remaining copper is eliminated. Plating is done with the help of a chemical solution that bonds all the layers. Proper cleaning is done later—a thin layer of copper coats to seep through the holes.

IMAGING OF OUTER LAYER– A photoresist layer, as indicated above, is applied and hardened under UV light for the outer layer. It is then released for imaging.

PLATING & ETCHING– As in the step of Drilling & Plating, a thin layer of copper is used to plate the panel. Tin guard, a thin layer of tin, to shield the outer layer, is added to the board. Extra copper is etched using same solution as above.

APPLICATION OF SOLDER MASK– The panels are cleaned, and a solder mask application is made. This is the green color of the PCB. With UV light, an extra mask is eliminated. The solder mask is then baked to the PCB.

SILK SCREENING-This is where critical information is printed on the PCB. A last coat and process of curing is done to the PCB.

FINISHING OF SURFACE– Plating of PCB is done with a finishing which can be soldered to enhance the solder bond.

TESTING– A technician will carry a board testing session to ensure that the operation of PCB is as per the blueprint.

PROOFING & V-SCORING– Boards are sliced from the panel using V-groove or a router to give you the final PCB.

After meeting all the steps above, the PCB manufacturing process is considered complete. You can manufacture many PCBs in one go.


PCB Manufacturing process is extensive, as mentioned in the above steps. PCB MANUFACTURING CHINA offers durable, high quality, high performance, and reasonably priced PCBs. The components used in the manufacture are of high-grade quality. The PCBs are delivered in quality packaging and promptly to the order. They offer a competitive price in the industry. Get in touch with the leading manufacturers to get the best quality PCBs for your electronic device assembly and other needs.