China PCB Assembly, PCB Assembly Manufacturers-6pcba

We can provide you with printed circuit board assembly, the quantity starts from 1 pc. To regular long-term operation, and to help you organize orders and parts (components widely used in our warehouse) and complete.

Extensive assembly techniques allow us to perform high-quality printed circuit board assembly of almost any complexity.

Technical assistance and our expert advice-a set of services, this is the scope of any customized duties we are prepared to give us.

You can pass to us the order of their organization and time cost, and in and in Banliu single account “product”, which includes the production of printed circuit boards, packaging and installation of your development.

All this allows you to apply and receive orders without leaving the office. As an intermediary, we provide each client with interesting and profitable working conditions.

• technical skills
• Design requirements
• Price, terms, delivery
• How to place an order for installation
• How to order molds
• quality
• equipmen

Our equipment allows you to perform:

• Automatic installation of SMD components with standard sizes from 0201 to 50x50mm.
• Manually assemble SMD components;
• Installation of pin components;
• Mixed installation of SMD and pin components;
• For installation of flexible and rigid boards;
• Installed on aluminum plate trumpet;
• Installation of microwave board;
• Use cleaning-free materials for installation (avoid cleaning)

China PCB Assembly In addition, we perform:

• Make a template for applying solder paste;
• Clean the circuit board from flux residue after installation (with or without ultrasonic);
• Apply moisture-proof coating;
• X-ray inspection of welded joints;
• AOI board control.

In the production process, the following materials are used:

• Solder paste indium NC-SMQ92H;
• Henkel X3312i Henkel’s flux;
• The washing liquid “Ultraklin” produced by JSC “Dipol-Technologies”;
• Waterproof coating Cramolin carbamate, Cramolin plastic, DowCorning DC-1-2577.

China PCB Assembly technical skills

3 SMD mounting lines (MY100-2 lines, MY9-1 lines) based on Mycronic’s high-precision automatic installation program allow you to install most of the existing components (chips, BGA, QFP, SOP, SOJ, PLCC, FlipChip) 0201 and the lead lead spacing is 0.1 mm. Components, up to 50 x 50 mm BGA microcircuit. The repeatability of IPC 9850 component placement is 45 microns per 3 sigma. The component orientation accuracy is 0.05 degrees.

After the mounting plate is cleaned in the cleaning system Uniclean. This is a very flexible system, you can choose the surface mixing method. We can perform agitation cleaning without ultrasonic agitation. After the liquid on the washing plate has been tested, it should be washed in cascade in deionized water.

Large quantities of plates are verified by Nordson YESTECH Automatic Optical Inspection (AOI) system, which is based on machine vision technology and is more effective than human visual inspection on inspection tools.

We can inspect solders that cannot be visually inspected on the Dage X-ray inspection system. At the same time, it is easy to check whether there is no short circuit or displacement. The number of voids in the solder joints, the presence of solder, and the distribution of solder under the heat sink of the heating component are evaluated

China PCB Assembly Design requirements

1. General requirements for printed circuit boards and circuit boards.

1.1. The preferred printed board is small, which has SMD components on one side.

1.2. When placing components on a printed circuit board, it is best to place larger components on one side (microcircuits, transistors in DPAK housings, electrolytic capacitors, large chokes, optocouplers, etc.).

1.3. The printed circuit board must have a solder mask.

1.4. There must be a solder mask between the pins of the microcircuit (except when the gap between the pins is less than the minimum mask width).

1.5. There should be no holes on the pads of the SMD leads. All holes near the venue must be covered with a mask. This is to prevent the solder from flowing into the hole.

1.6. There should be no vias or conductors under the SMD components that are not covered by solder resist.

1.7. All jumpers between pads used for SMD microcircuits must be located outside the soldering area.

1.8. The pads of the same pins of the leadless microcircuit (for example, in QFN and detailed packaging) must be the same.

You cannot reach the same conclusion on different sites.

1.9. The mark should not pass through the pad and should be located in the soldering area.

1.10. The boards and printed circuit boards used for SMD mounting must meet the requirements in Section 2.

2. Requirements for printed circuit boards and automatic assembly.

2.1. The small printed circuit board must be rectangular.

2.2. If the printed circuit board and is not rectangular, then it should be in the frame. The frame is the technical field

It simplifies the process of installing printed circuit boards in printers, robots, and reflow ovens.

The frame leader changes the template s into a rectangle.

2.3. The width of the technical field is 5 mm. The fiducial mark is located at the corner.

2.4. The printed circuit board components are arranged on the edge of the board smaller than 7 mm. It must also be equipped with technical fields, at least in terms of violating the “7 mm rule.”

2.5. The size of the printed circuit board is smaller than 100*100mm. Must be collected in the panel.

2.6. The small size of the printed circuit board is greater than 100×100 mm. Also hope to be combined into a panel.

2.7. The maximum size of the panel is 200 * 255mm. (For special cases, more can be done, but we must consult with us.)

2.8. The sales volume of printed circuit boards exceeds 100 pieces. It must be integrated into the panel so that its size is close to the maximum.

2.9. On each board e (even in the preform), it is desired that the reference points (hereinafter referred to as RH) are arranged diagonally to each other on the diagonal printed circuit board s at the maximum distance, but when the board s is turned over at 180° RH must overlap at least 2. Mm (along one of the axes).

2.10. If it is not possible to make the internal RE board s they are placed in the technical field.

2.11. Reference mark design. There are two types of fiducial marks: round and square. The first round is shown below. Make a square in the same way, but make a square with a side of 1-2mm instead of an outer circle.

Panelization (or multiplexing) makes the processability of printed circuit boards higher. It greatly reduces the time for applying solder paste, mounting the board in the mounter, and cleaning operations. Through cleaning, Panelize improves the cleaning effect because it can properly fix the cleaning effect of the printed circuit board without reducing performance.
The regular circuit boards used to form printed panels are given in STP.PAUR.07-2015 assembled printed circuit boards in the panel.

3. Complete automatic installation requirements.
3.1. The components must use the original packaging (matrix (tray), rod (tube), tape).

3.2. Bulk components are not allowed.

3.3. It is not allowed to cut the ribbon into pieces.

3.4. Adhesive tape, winding tape, and stapler staples are not allowed. These foreign objects can damage the moving parts of the installer.

3.5. Except for expensive components, the margin for all components must be 3% of the required quantity, but no less than 10 pieces.

3.6. Except for expensive and rare components, the minimum tape length for all tapes:

Suitable for 2mm strip-shaped components. (For example, chip 0402, there are 2 components between two perforations), the minimum length of tape is 50 pieces.
For strip components with a pitch of 4 mm. (For example, chips 0603, 0805, only one component in each perforation), the minimum tape length is 25.
3.7. If the component name is different from the name declared in the specification, it should be accompanied by a description of the correct replacement information. For any form of comment, the only requirement is that the information must be related to the customer, order, component, and date. This is done to interest both the order fragment and the artist.