22 Layers Rigid PCB
22 Layers Rigid PCB
Layers: 22 layers
Material: FR4
Thickness: 5.0mm
Finished Copper: 35um
Surface Finish: ENIG
Silkscreen Color: White
Min Spacing: 6/6mil
Min Hole Size: 0.3mm ↑
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Kingford PCB Electronics Co., Ltd with 18 years of experience in PCB manufacturing, as one of the Chinese most professional PCB & Assembly & Components Sourcing manufacturers, always are market-oriented and customer-centric, providing the high-quality products and great services. With over 12 SMT lines and 60 equipment and can assure 100% timely delivery.

22 Layers Rigid PCB
Layers 22 layers
Material FR4
Thickness 5.0mm
Unit size/mm 214mm*182mm
Finished Copper 35um
Surface Finish ENIG
Solder Mask Green
Silkscreen Color White
Min Spacing 6/6mil
Min Hole Size 0.3mm ↑
Special Technology Press holes
PCB Manufacturing Capacity
Base material FR-4/CEM-1/CEM3/Ceramic/Teflon/Aluminum/Copper etc.
PCBs Rigid(0-22layers), Flexible(1-8layers), Rigid-flex(1-16layers, flex 8layers), MCPCB(aluminum and copper1-4layers)
Board thickness 0.2mm – 10mm
Copper thickness 0.25 Oz – 8 Oz
Max Panel Size 1500 mm × 560 mm
Min. Hole Size 0.075mm (3mil)
Min. Line Width / Spacing 3mil
Surface Finishing HASL/HAL, HASL Lead Free, ENIG, immersion silver, immersion tin, OSP, Plating Hard Gold, etc.
Solder Mask Color White, Black, Yellow, Green, Red, etc.
Silkscreen Color Black, White, Yellow, Red, Blue, etc.
Special Process Buried hole, blind hole, Soldermask ink, Epoxy resin, Copper, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and impedance control.
PCB Assembly Capacity
SMT Capability 5KK points/Day, single-sided/double-sided, 10 Lines
Reject rate of components 0.3% (Capacitor and Resistance) No(IC)
Min. Package 01005 chip / 0.35 Pitch BGA
Min. Precision +/-0.04mm
Min. Precision of IC +/-0.03mm
SMD Size 0201-150mm
Max. Height of components by machine 30mm
Min. Pin pitch of SMT 0.2mm
Min. Ball pitch of SMT 0.2mm
Min. Precision of Stencil 5um
PCB Size of Assembly 5x5mm – 500×1500mm
PCB Thickness of Assembly 0.1 – 10mm
BGA/μBGA Available; Solder paste / glue processing
DIP capacity 0.30 million points per day
Max. Capability Stable support for 200 products on the production line at the same time
Functional testing & Casing assembly Upon customer’s requirements

Our Implementing Strict Quality Control System:

  • UL-recognized
  • Automatic optical inspection
  • 100% open short testing
  • IPC A-600G
  • ISO 9001-, ISO 14001-, ISO/TS 16949, ISO13485, IATF-16949, OHSAS18001 certified
  • Statistical Process Control (SPC)
  • Impedance control

 

Services and Support:

  • Customer Services: Online Email/Telephone/EC provides customer 24-hour services; Great pre-sales, sales,after-sales services.
  • Sample Availability & Policy: Sample quotation within three days; the sample is finished within one week.
  • Guarantees/Warranties/Terms and Conditions: We guarantee pre-payment.
  • Export/Import Processing Support: Our export and import support service are EX-Factory, FOB HK, FOB Shenzhen, FCA HK, FCA Shenzhen and DDU by express.
  • After Sales Service: For all problems encountered kindly contact us, we will do the after service at any time.

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