6 Layers Rigid PCB
Layers: 6 layers
Material: FR4
Thickness: 1.6mm
Finished Copper: 35um
Surface Finish: ENIG
Silkscreen Color: White
Min Spacing: 6/6mil
Min Hole Size: 0.3mm ↑
Kingford PCB Electronics Co., Ltd with 18 years of experience in PCB manufacturing, as one of the Chinese most professional PCB & Assembly & Components Sourcing manufacturers, always are market-oriented and customer-centric, providing the high-quality products and great services. With over 12 SMT lines and 60 equipment and can assure 100% timely delivery.
| 6 Layers Rigid PCB | |
|---|---|
| Layers | 6 layers |
| Material | FR4 |
| Thickness | 1.6mm |
| Unit size/mm | 108mm*97mm |
| Finished Copper | 35um |
| Surface Finish | ENIG |
| Solder Mask | Blue |
| Silkscreen Color | White |
| Min Spacing | 6/6mil |
| Min Hole Size | 0.3mm ↑ |
| PCB Manufacturing Capacity | |
|---|---|
| Base material | FR-4/CEM-1/CEM3/Ceramic/Teflon/Aluminum/Copper etc. |
| PCBs | Rigid(0-22layers), Flexible(1-8layers), Rigid-flex(1-16layers, flex 8layers), MCPCB(aluminum and copper1-4layers) |
| Board thickness | 0.2mm – 10mm |
| Copper thickness | 0.25 Oz – 8 Oz |
| Max Panel Size | 1500 mm × 560 mm |
| Min. Hole Size | 0.075mm (3mil) |
| Min. Line Width / Spacing | 3mil |
| Surface Finishing | HASL/HAL, HASL Lead Free, ENIG, immersion silver, immersion tin, OSP, Plating Hard Gold, etc. |
| Solder Mask Color | White, Black, Yellow, Green, Red, etc. |
| Silkscreen Color | Black, White, Yellow, Red, Blue, etc. |
| Special Process | Buried hole, blind hole, Soldermask ink, Epoxy resin, Copper, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and impedance control. |
| PCB Assembly Capacity | |
|---|---|
| SMT Capability | 5KK points/Day, single-sided/double-sided, 10 Lines |
| Reject rate of components | 0.3% (Capacitor and Resistance) No(IC) |
| Min. Package | 01005 chip / 0.35 Pitch BGA |
| Min. Precision | +/-0.04mm |
| Min. Precision of IC | +/-0.03mm |
| SMD Size | 0201-150mm |
| Max. Height of components by machine | 30mm |
| Min. Pin pitch of SMT | 0.2mm |
| Min. Ball pitch of SMT | 0.2mm |
| Min. Precision of Stencil | 5um |
| PCB Size of Assembly | 5x5mm – 500×1500mm |
| PCB Thickness of Assembly | 0.1 – 10mm |
| BGA/μBGA | Available; Solder paste / glue processing |
| DIP capacity | 0.30 million points per day |
| Max. Capability | Stable support for 200 products on the production line at the same time |
| Functional testing & Casing assembly | Upon customer’s requirements |
Our Implementing Strict Quality Control System:
- UL-recognized
- Automatic optical inspection
- 100% open short testing
- IPC A-600G
- ISO 9001-, ISO 14001-, ISO/TS 16949, ISO13485, IATF-16949, OHSAS18001 certified
- Statistical Process Control (SPC)
- Impedance control
Services and Support:
- Customer Services: Online Email/Telephone/EC provides customer 24-hour services; Great pre-sales, sales,after-sales services.
- Sample Availability & Policy: Sample quotation within three days; the sample is finished within one week.
- Guarantees/Warranties/Terms and Conditions: We guarantee pre-payment.
- Export/Import Processing Support: Our export and import support service are EX-Factory, FOB HK, FOB Shenzhen, FCA HK, FCA Shenzhen and DDU by express.
- After Sales Service: For all problems encountered kindly contact us, we will do the after service at any time.
Successful customer case
Customer: xxx Science Technology Co., Ltd.
Application: Security monitoring equipment
Layers: 6 layers board
Delivery time
Sample:6-7 working days
Mass production:10-15 working days
Service: Free Quote in 24H, Quick turn delivery, Strict quality control, Professional equipment testing, Package and delivery and Providing customers with high quality after sales service.
Here is our customer feedback，Our primary objective is to satisfy our customers by providing well-qualified product and service.
Our Quality control procedures
Decades of experience in making circuit boards has enabled us to accumulate rich experience and have a strict and perfect management and control system in terms of process flow transformation and quality control.
- Analysis and processing of process files: From the time of receiving the production order, our engineers will analyze whether the circuit board design files are correct, and if any problems are found, they will be reported back to the customer for confirmation or modification in a timely manner to establish the process method. And the direction on the solder mask.
- Storage, opening and drilling of copper-clad laminates: Select the best A-grade copper-clad laminates in the market for classified storage, edging and chamfering to prevent damage to the film, and bring impurities to the plating tank to pollute the plating solution, and accurately measure the drill tip Repeat the inspection before drilling to avoid using the wrong drill bit. After drilling, check whether the hole is misaligned, the hole diameter is correct, and whether it is empty.
- Immersion copper and electroplating: The concentration of the potion in the electroplating line is regularly checked to ensure that the electroplating is always at a stable level. Cross-section sections of each batch of circuit boards should be made. Check whether the copper in the hole is under an electron microscope Whether the thickness and quality of the layer meet the requirements. The circuit board slice report of each batch is archived in the circuit board factory for future reference.
- Darkroom screen printing workshop control: the viscosity of the ink is an important process parameter of the circuit board, the time and speed of stirring and the temperature and humidity of the environment are strictly controlled.
- Testing and problem improvement: Flying probe test for prototypes and small batch test boards, to ensure that the circuit board’s electrical performance meets the requirements, and also to check the process control level of the production process, and test the test stand of batch circuit boards to ensure the electrical performance of the factory circuit board % Pass, classify and make problem patterns for the problems in the circuit board process to facilitate improvement.