1500mm LED Double Layer PCB
1500mm LED Double Layer PCB
1500mm LED Double Layer PCB
1500mm LED Double Layer PCB
Layers: 2 layers
Material: FR4
Thickness: 1.6mm
Finished Copper: 35um
Surface Finish: OSP
Silkscreen Color: Black
Min Spacing: 6/6mil
Min Hole Size: 0.3mm ↑
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1500mm LED Double Layer PCB
Layers 2 layers
Material FR4
Thickness 1.6mm
Unit size/mm 1500*25.9mm
panel size/mm 1500mm*254mm
Finished Copper 35um
Surface Finish OSP
Solder Mask White
Silkscreen Color Black
Min Spacing 6/6mil
Min Hole Size 0.3mm ↑
PCB Manufacturing Capacity
Base material FR-4/CEM-1/CEM3/Ceramic/Teflon/Aluminum/Copper etc.
PCBs Rigid(0-22layers), Flexible(1-8layers), Rigid-flex(1-16layers, flex 8layers), MCPCB(aluminum and copper1-4layers)
Board thickness 0.2mm – 10mm
Copper thickness 0.25 Oz – 8 Oz
Max Panel Size 1500 mm × 560 mm
Min. Hole Size 0.075mm (3mil)
Min. Line Width / Spacing 3mil
Surface Finishing HASL/HAL, HASL Lead Free, ENIG, immersion silver, immersion tin, OSP, Plating Hard Gold, etc.
Solder Mask Color White, Black, Yellow, Green, Red, etc.
Silkscreen Color Black, White, Yellow, Red, Blue, etc.
Special Process Buried hole, blind hole, Soldermask ink, Epoxy resin, Copper, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and impedance control.
PCB Assembly Capacity
SMT Capability 5KK points/Day, single-sided/double-sided, 10 Lines
Reject rate of components 0.3% (Capacitor and Resistance) No(IC)
Min. Package 01005 chip / 0.35 Pitch BGA
Min. Precision +/-0.04mm
Min. Precision of IC +/-0.03mm
SMD Size 0201-150mm
Max. Height of components by machine 30mm
Min. Pin pitch of SMT 0.2mm
Min. Ball pitch of SMT 0.2mm
Min. Precision of Stencil 5um
PCB Size of Assembly 5x5mm – 500×1500mm
PCB Thickness of Assembly 0.1 – 10mm
BGA/μBGA Available; Solder paste / glue processing
DIP capacity 0.30 million points per day
Max. Capability Stable support for 200 products on the production line at the same time
Functional testing & Casing assembly Upon customer’s requirements

Full Range Of Testing Services:

  • AOI
  • Function testing
  • In-circuit testing
  • X-ray for BGA testing
  • 3D paste thickness test
  • Flash testing and earth bonding tests can also be undertaken where required

 
Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested.
 

Advantages:

  • No MOQ
  • 18 years of PCB&PCBA turnkey services
  • Quick turn, Prototype, Low & medium & high volume
  • Components sourcing, ODM&OEM services provide
  • ISO 9001-, ISO14001-, ISO/TS16949, ISO13485, IATF16949, OHSAS18001 certified, UL E352816
  • 100% E-test,100% visual inspection, including IQC, IPQC, FQC, and OQC
  • 100% AOI inspection, including X-ray, 3D microscopy and ICT
  • Fast response within 24 hours, great pre-sales, sales, after-sales
  • All kinds of Export/Import Processing Support, EX-Factory, FOB HK, FOB Shenzhen, FCA HK, FCA Shenzhen and DDU by express
  • All kinds of payment: T/T, Paypal, WesternUnion
  • Guarantee Sales Service, for all problems, encountered kindly contact us, we will do the after service at any time

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