1500mm LED Double Layer PCB
Layers: 2 layers
Material: FR4
Thickness: 1.6mm
Finished Copper: 35um
Surface Finish: OSP
Silkscreen Color: Black
Min Spacing: 6/6mil
Min Hole Size: 0.3mm ↑
| 1500mm LED Double Layer PCB | |
|---|---|
| Layers | 2 layers |
| Material | FR4 |
| Thickness | 1.6mm |
| Unit size/mm | 1500*25.9mm |
| panel size/mm | 1500mm*254mm |
| Finished Copper | 35um |
| Surface Finish | OSP |
| Solder Mask | White |
| Silkscreen Color | Black |
| Min Spacing | 6/6mil |
| Min Hole Size | 0.3mm ↑ |
| PCB Manufacturing Capacity | |
|---|---|
| Base material | FR-4/CEM-1/CEM3/Ceramic/Teflon/Aluminum/Copper etc. |
| PCBs | Rigid (0-22layers), Flexible (1-8layers), Rigid-flex (1-16layers, flex 8layers), MCPCB(aluminum and copper1-4layers) |
| Board thickness | 0.2mm – 10mm |
| Copper thickness | 0.25 Oz – 8 Oz |
| Max Panel Size | 1500 mm × 560 mm |
| Min. Hole Size | 0.075mm (3mil) |
| Min. Line Width / Spacing | 3mil |
| Surface Finishing | HASL/HAL, HASL Lead Free, ENIG, immersion silver, immersion tin, OSP, Plating Hard Gold, etc. |
| Solder Mask Color | White, Black, Yellow, Green, Red, etc. |
| Silkscreen Color | Black, White, Yellow, Red, Blue, etc. |
| Special Process | Buried hole, blind hole, Soldermask ink, Epoxy resin, Copper, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and impedance control. |
| PCB Assembly Capacity | |
|---|---|
| SMT Capability | 5KK points/Day, single-sided/double-sided, 10 Lines |
| Reject rate of components | 0.3% (Capacitor and Resistance) No(IC) |
| Min. Package | 01005 chip / 0.35 Pitch BGA |
| Min. Precision | +/-0.04mm |
| Min. Precision of IC | +/-0.03mm |
| SMD Size | 0201-150mm |
| Max. Height of components by machine | 30mm |
| Min. Pin pitch of SMT | 0.2mm |
| Min. Ball pitch of SMT | 0.2mm |
| Min. Precision of Stencil | 5um |
| PCB Size of Assembly | 5x5mm – 500×1500mm |
| PCB Thickness of Assembly | 0.1 – 10mm |
| BGA/μBGA | Available; Solder paste / glue processing |
| DIP capacity | 0.30 million points per day |
| Max. Capability | Stable support for 200 products on the production line at the same time |
| Functional testing & Casing assembly | Upon customer’s requirements |
Full Range Of Testing Services:
- AOI
- Function testing
- In-circuit testing
- X-ray for BGA testing
- 3D paste thickness test
- Flash testing and earth bonding tests can also be undertaken where required
Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested.
Advantages:
- No MOQ
- 18 years of PCB&PCBA turnkey services
- Quick turn, Prototype, Low & medium & high volume
- Components sourcing, ODM&OEM services provide
- ISO 9001-, ISO14001-, ISO/TS16949, ISO13485, IATF16949, OHSAS18001 certified, UL E352816
- 100% E-test,100% visual inspection, including IQC, IPQC, FQC, and OQC
- 100% AOI inspection, including X-ray, 3D microscopy and ICT
- Fast response within 24 hours, great pre-sales, sales, after-sales
- All kinds of Export/Import Processing Support, EX-Factory, FOB HK, FOB Shenzhen, FCA HK, FCA Shenzhen and DDU by express
- All kinds of payment: T/T, Paypal, WesternUnion
- Guarantee Sales Service, for all problems, encountered kindly contact us, we will do the after service at any time