Kingford adiciona sistema de detecção de raios-X e conhecimento relacionado a raios-X

Parabéns! A fim de oferecer aos clientes maior precisão e melhores serviços de inspeção,   Kingford PCB  adiciona um sistema de inspeção X-Ray viewX1800. Esperando criar mais produtos de alta qualidade para nossos clientes e garantir que eles sintam mais tranquilidade e tranquilidade!

Como funciona o X - R ay ?

X-Ray is a high-performance detection device that uses a cathode ray tube to generate high-energy electrons to collide with a metal target. During the impact, the lost kinetic energy is released in the form of X-Ray due to sudden deceleration of electrons. For the position where the sample cannot be detected by the appearance, by using the change of the light intensity of the X-Ray after penetrating the different density substances, the contrast effect produced can form an image to display the internal structure of the object to be tested, and thus can be observing the problematic area inside the object to be tested while destroying the object to be tested.

X-Ray A pplication

Used for detection of defects and cracks in metal materials and parts, plastic materials and parts, electronic components, LED components, etc., internal displacement of BGA and circuit boards, and identification of empty welding, virtual welding, etc. BGA welding defects, microelectronic systems and sealing components, cables, fixtures, and internal analysis of plastic parts.

X-Ray Scope of application

• Semiconductor
• Automotive electronics
• PCB/PCBA
• LED
• BGA/QFN detection
• Aluminum die castings
• Molded plastic parts
• Electrical and mechanical components
• Biological agriculture seed
• Aviation component
• Tire wheel
• Harness / USB / plug

Why SCIENSCOPE View X1800?

1.Clear and undistorted image

Using the most advanced micro-focus spot X-ray tube & digital flat-panel detector, the latest upgraded image processing technology.

2. Função de etapa do CNC e programa de detecção e determinação automática

Melhore muito a capacidade de detecção e reduza o custo do trabalho

3. Função de retenção do centro da tela de detecção

Durante a detecção de inclinação, o objeto a ser detectado está sempre no centro da tela e a ampliação é sempre a mesma.

X-Ray A dvantage

X-RAY detection technology has brought new changes to SMT production testing methods. It can be said that it is the most demanding manufacturer who is eager to further improve the SMT production process level, improve production quality, and will find circuit assembly failures in time. Good choice. With the development trend of SMT workshops, other assembly fault detection methods are difficult due to their limitations. X-RAY automatic inspection equipment will become the new focus of SMT production equipment and play an increasingly important role in the field of SMT production, as shown below.

1. A cobertura de defeitos de processo chega a 97%. Os defeitos inspecionáveis ​​incluem: juntas de solda, pontes, solda, solda insuficiente, poros, dispositivo faltando e assim por diante. Em particular, o X-RAY também pode ser inspecionado para dispositivos ocultos de junta de solda, como BGA e CSP.

2. Maior cobertura de teste. O equipamento de inspeção de Raios-X no SMT pode ser inspecionado onde não for visível a olho nu e testes online. Por exemplo, se o PCBA for considerado defeituoso, suspeita-se que a camada interna do PCB está quebrada e o raio-X pode ser verificado rapidamente.

3. O tempo de preparação para o teste é bastante reduzido.

4. Podem ser observados defeitos que não podem ser detectados de forma confiável por outros métodos de teste, como: solda virtual, orifícios de ar e moldagem deficiente.

5. O equipamento de inspeção de RAI-X requer apenas uma inspeção de placas duplas e multicamadas (com função de camadas)

6.Provide relevant measurement information to evaluate the production process in SMT. Such as the thickness of the solder paste, the amount of solder under the solder joints, and so on.

7.The X-ray inspection perspective can clearly see the three-dimensional structure of the SoC processor and the surrounding circuit board, especially the peripheral perforations. Provide sufficient basis for whether the welding is ok or false welding.

Summary

X-ray three-dimensional perspective imaging technology brings new changes to the electronic manufacturing quality inspection method. It is the best choice for manufacturers who further improve the production process level, improve production quality, and discover electronic assembly failures in time as a breakthrough. With the development trend of electronic packaging devices, other assembly fault detection methods are difficult due to their limitations. X-Ray three-dimensional imaging inspection equipment will become the new focus of electronic packaging device production equipment and play an irreplaceable role in its production field. effect.