Cilat janë kërkesat teknike për bordet 5G PCB

With the rapid development and progress of the times, communication technology and communication products have also made great achievements and progress. With the advent of 5G PCB boards technology and products, the requirements of the communication industry for PCB boards are also constantly increasing. As a very important electronic component in communication products, the development of the bordit të PCB industry will also face new challenges. In order to adapt to the development of 5G PCB board technology, the performance and technical requirements of PCB board will also put forward higher requirements and standards. This article will briefly introduce the PCB sheet and industry characteristics, briefly explain the application of PCB in the communication industry in the 5G era, and finally make a brief analysis of the technical requirements of 5G products for the bordit të PCB . I hope to bring some help and inspiration to relevant practitioners.

Keywords: 5G products; PCB sheet; Technical requirements

1、Overview of PCB sheet

PCB is a printed circuit board. As an important electronic component in electronic products, PCB is usually composed of a conductor and an insulating substrate, and plays a supporting and connecting role to electronic components in electronic products. The quality of PCBs has a great impact on electronic products, and different products have different requirements for bordit të PCB technology. The PCB is usually a copper-clad laminate, and then the circuit is processed on the substrate material by chemical processing. In addition, for multi-layer PCBs, the conductive pattern layer, prepreg and thin copper foil are usually pressed together. The quality and performance of the PCB mainly depends on the material of the substrate, so whether its technical performance can meet the product requirements , Will directly affect product quality.

2、Characteristics of the PCB industry and the needs of the 5G era  and   5G PCB board Industry Features

According to the different usage scenarios and functions of the PCB board industry, customized production is more adopted in production. It has specific requirements for plate thickness materials, line width and line spacing, etc., and therefore has a high degree of customization. In addition, due to its customized characteristics, it is not possible to ensure efficiency improvement while expanding the scale, and the industry structure is relatively scattered. In addition to the above two points, due to the small technical differences in the PCB board industry, it is more about cost control, so its industry profit comes more from cost control.

3、5G era needs

PCB boards are used in many areas of the communications industry, including wireless networks, transmission networks, data communications, and fixed-line broadband. With the advent of the 5G era, the communications field has placed higher requirements on PCB boards and brought new developments. Opportunity. Take the communication base station as an example. In the 4G era, a communication base station usually consists of a baseband processing unit, a single RF processing unit, and an antenna. Its public radio interface transmission volume is about 10Gbps. In the 5G era, such information transmission volume is obviously not enough Therefore, the rapid development of 5G technology will bring new changes to the structure of communication base stations, and the structure of base stations will change accordingly. 5G base stations use Massive MIMO antennas to form a new active antenna unit. The remaining baseband processing units are divided into a two-level architecture of a distribution unit and a central unit.Etc. can be counted among them. In order to meet the requirements of 5G products, the size of its core board must ensure stability and control the dimensional change within the allowable range.

4、5GPCB board resists deformation

As the products have higher requirements for PCB boards, PCBs need to improve the anti-deformation ability of PCB boards in order to achieve local hollowing, mixed pressing of boards, and large-sized thin plates. The requirements for PCB boards are flatness and toughness. PCB boards are easily deformed during the welding process, which often results in products that do not meet the required standards. With the rapid development of the communication industry, when such large-sized and small-sized PCBs encounter similar requirements as local hollowing out, the plate will easily deform and cause serious consequences. At present, many PCBs are To ensure that the cost increase will not be too high, to meet the 5G high-frequency requirements, many companies will mix special materials such as FR4 and PTEE, and there will be mismatches in mechanical properties, which will easily cause problems such as PCB deformation.
5. Stable Dk / Df
Në përgjithësi, shkalla e transmetimit të sinjalit dhe cilësia e transmetimit kanë të bëjnë me konstantën dielektrike (Dk) dhe humbjen dielektrike (Df). Për shkak se shpejtësia e transmetimit të sinjalit është në përpjesëtim të zhdrejtë me rrënjën katrore të konstantës dielektrike (Dk), dhe sa më e vogël të jetë humbja dielektrike (Df), sinjali Sa më i vogël të jetë humbja, kështu që PCB-të me frekuencë të lartë dhe me shpejtësi të lartë duhet të arrijnë transmetim të ulët vonesa, humbja e ulët e transmetimit dhe kërkesa të tjera. Kërkohet që Dk e pllakës të jetë e vogël dhe e qëndrueshme, dhe Df duhet të jetë e vogël. Në ditët e sotme, kërkesa për transmetimin e informacionit po rritet gjithashtu, dhe shkalla e sinjalit të pajisjeve të komunikimit po rritet vazhdimisht. Sidoqoftë, kur shpejtësia e sinjalit është mbi 5Gbps, performanca e transmetimit të energjisë së PCB do të ndikohet. Për shembull, qëndrueshmëria e frekuencës së bordit, anizotropia e bordit PCB, dhe temperatura dhe lagështia e ambientit do të shkaktojnë një shkallë të caktuar të ndikimit. Për Dk / Df të një bordi PCB, në mënyrë që të arrihet mbulimi i sinjaleve me shpejtësi të ulët dhe sinjaleve me shpejtësi të lartë në të njëjtën PCB, është më mirë të sigurohet qëndrueshmëria e Dk / Df e saj për të përmbushur kërkesat e përdorimit të produktit. Në mënyrë të ngjashme, për ndikimin e temperaturës dhe lagështisë së ambientit, është gjithashtu e nevojshme të sigurohet qëndrueshmëria e tij.
 6. Thermal conductivity requirements
In order to facilitate people’s daily use, electronic products are becoming thinner and thinner. When designing products, many components are more concentrated and power is increased accordingly. Therefore, the line width on the PCB is reduced, and the copper surface is reduced. As a result, its heat conduction is more difficult and the fever is serious. PCB overheating will affect the operating conditions and life of the components. Therefore, the problem of PCB heat conduction is also one of the important issues that the PCB industry needs to solve at present. The PCB overheating problem can be improved by buried copper blocks, heat dissipation vias, selecting a metal substrate, and selecting a thermally conductive plate.