Via in Pad

Via in Pad Manufacturer & Assembly – One-stop service

Via in Pad (VIP) technology basically refers to the technique of placing vias directly under the component contact pads. Especially BGA pads with finer pitch array packages. In other words, the VIP technique causes the vias to be plated or hidden under the BGA pads. Requiring PCB manufacturers to use resin inserts to make them invisible before copper plating.

With the increasing density and interconnectedness of circuit boards, the Via-in-Pad technology has emerged to achieve higher density PCBs and save space, making PCB footprint smaller and wiring. Getting better and better.

As we all know, the printed board plugging process is a process that is produced by the higher requirements of the printed board manufacturing process and surface mount technology.

The plugging effect has the following points:

  • Prevents short-circuiting of tin from the via through the component surface during PCB over-wave soldering.
  • Avoid flux remaining in the vias.
  • Prevents the soldering of the solder balls from over-wave soldering, causing a short circuit.
  • Prevent surface solder paste from flowing into the hole to cause solder joints, affecting placement.

Via in Pad-KINGFORD

Via in Pad common problem analysis:

The most difficult thing to control for the hole in the pad is that there are tin beads or ink pads on the hole. This is the so-called oil explosion phenomenon. Some customers in our company have very strict requirements on the solder pad and the appearance of the solder mask.

There is a requirement for a hole in the pad, and the most difficult thing to control before we produce this plate is the problem of oil explosion caused by curing or tinning, which causes soldering on the pad and the hole in the hole.

Curing or tinning is a process in which the solvent of the plug ink evaporates and the resin shrinks. Therefore, improper control is the most prone to the occurrence of tin beads or oil explosion in the hole.

Via in pad

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